Automated Wafer Level Tester Tool

Summary

The tender concerns the delivery, installation and commissioning in Eindhoven of an automated wafer-level electrical/optical test system for Technische Universiteit Eindhoven. The system must support full-wafer photonic and/or electronic measurements, integrated probing and optical access, wafer handling from 150 to 200 mm, high-precision positioning, sensitive electrical and optical measurements, temperature-controlled testing, automated alignment and calibration, data export, integration with external manufacturing and monitoring systems, and continuous automated operation. Delivery and installation must be completed within eight months after ordering. The tenderer must submit the completed minimum-requirements form, price form, experience form, agreement declaration and the required European self-declaration. The deadline is 2 October 2026 at 14:00. Price accounts for 40% and quality for 60%.