Deep Reaction Ion Etcher (DRIE)

Summary

Uppsala University is procuring a deep reactive ion etcher (DRIE) for the Myfab Uppsala university laboratory. The system will transfer patterns made using photolithography and electron-beam lithography and etch silicon and compatible materials, supporting processes from low to high etch rates, wafer dicing, high uniformity, high open area, high aspect ratios and nanometre-scale features. The procurement also provides for a service agreement, updates, upgrades, accessories and additional functions.