Wafer-Level Reliability Testing System

Summary

The tender concerns the delivery, installation and commissioning of a wafer-level reliability testing system for Technische Universiteit Eindhoven in Eindhoven. The system must support full-wafer electrical and optical testing and meet extensive requirements for accuracy, temperature control, automation, data exchange, reliability and serviceability. Delivery and installation must be completed within 8 months after order placement; the planned contract period is 36 months. The submission deadline is 20 October 2026 at 14:00. The tenderer must demonstrate experience during the past 10 years in delivering, installing and servicing at least one comparable wafer-level reliability testing system for a university or other research institute. The proposal must include the completed minimum-requirements annex, a technical experience reference, the price form and the other required tender documents. Price and quality each account for 50% of the evaluation.