Automated Wafer Level Inspection Tool

Summary

The tender concerns the supply, installation, commissioning and training related to an automated wafer-level inspection tool for Eindhoven University of Technology in Eindhoven. The system must support cassette loading and inspection of full wafers, including defect detection and classification, and handle wafer sizes from 150 to 200 mm. Mandatory requirements include CE compliance, documentation, delivery and installation within eight months after ordering, a maximum weight of 1,500 kg, free software updates for five years, and a 24-month warranty with preventive maintenance after the Site Acceptance Test. The tender must be submitted electronically by 2 October 2026 at 14:00. Price carries 60% and quality 40% of the evaluation weighting.