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Tender detail

Dicing blades for silicon wafers

Summary

The procurement is for dicing blades used to cut silicon wafers and compatible with the DISCO DFD6340 wafer dicing machine. The deadline for submitting bids is 14 October 2026. Check the official tender notice and documents for the precise technical specifications and participation requirements.

Reference number
25875566-1
Buyer
Country
Germany (DEU)
Procedure
Open procedure
CPV
Deadline
2026-10-14
Status
Open
Contract subject
Estimated value
Not published
Source
DEU_BKMS
Open tender Open tender documents

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