300 mm profilometer

Summary

The procurement is for one 300 mm profilometer for measuring structure thickness, roughness and bow on the surfaces of 100–300 mm wafers and panels up to 300 × 300 mm. The instrument must meet detailed measurement, stage, software, installation-site and safety requirements, and include measurement and analysis software, calibrated height standards, and operating training for two engineers or technicians. Delivery and acceptance are due by 17 December 2026, and the net offer must not exceed €200,000. A 100% bank guarantee is required if delivery is planned later. The offer must state a binding delivery time in weeks and include a company profile, turnover figures for 2022–2024 (and 2025 if available), and at least three references for comparable projects dating from 2023 or later. Price accounts for 45% of the evaluation and technical features for 55%.