Deep Reactive Ion Etcher (DRIE)

Summary

Uppsala University is procuring one deep reactive ion etching system (DRIE) for Myfab Uppsala’s university laboratory. The equipment will transfer patterns created by photolithography and electron-beam lithography and support etching of silicon and compatible materials, using photoresist or hard masks. Its capabilities are intended to cover a range of etch rates, wafer dicing, high uniformity, large open areas, high aspect ratios and nanoscale features; service, updates, upgrades, accessories and additional functions may also be provided.