Photonic Wafer Probe Station and Photonic Assembly Station

Summary

The Technical University of Denmark (DTU) is procuring two separate items of equipment: a wafer probe station for optical and electrical characterisation of photonic integrated circuits (Lot 1), and a photonic assembly station for connecting optical chips and fibre array units (Lot 2). Tenderers may bid for either or both lots; the lots will be evaluated and awarded separately. The equipment must be delivered and installed at DTU’s campus in Lyngby. The probe station must support optical measurements, primarily through grating couplers, and also be configurable for edge coupling. Electrical characteristics must be measurable in DC and at radio frequencies up to 40 GHz. The assembly station must support connecting fibre array units to optical chips. For both lots, the award criteria are price (30%), machine characteristics (15%), process (40%), and installation, service and warranty (15%). Price is scored from 0 to 10: the lowest price receives 10 points, while a price at least 100% higher than the lowest receives 0 points. Tenders must be submitted electronically and include an ESPD. For either lot, the tenderer must have had annual net turnover of at least DKK 10,000,000 and positive equity in each of the last 3 audited financial years. The tenderer must also provide at least 2 references for comparable contracts, each worth at least DKK 3,000,000; delivery, installation and testing of the equipment under each reference must have been approved within the last 3 years. The equipment must be comparable to that required for the relevant lot. A tenderer unable to meet the reference requirement may rely on other entities’ capacities or form a consortium. The submission deadline is 2 November 2026 at 22:59.