Deposition tool for 8-inch wafers

Summary

The Technical University of Munich, Chair of Technical Physics E23/WMI, is procuring an ultra-high-vacuum cluster system for fabricating superconducting circuits on 8-inch wafers. The system must include an HV load-lock chamber, central handling chamber, UHV chambers for aluminium thin-film evaporation, superconductor sputtering, oxidation and argon-ion milling, plus a flipping station. It must enable in-situ metallisation of both wafer sides with minimal backside particle contamination, using side or edge gripping only. The machine-readable notice does not specify the exact bidder qualification or exclusion requirements; these must be checked in the official tender documents.