Flip-chip die bonder

Summary

The tender concerns the supply of a flip-chip die bonder for semiconductor assembly. The equipment must place chips onto sensors with micrometre precision and support bonding technologies such as soldering, thermal bonding and conductive adhesive bonding. The tender deadline is 14 September 2026 at 00:00. Precise qualification, exclusion and compliance requirements were not included in the machine-readable notice and must be checked in the official tender documents.