Chemical-mechanical polishing machine

Summary

The tender concerns the supply of a new chemical-mechanical polishing machine to Friedrich Schiller University Jena. The machine will be used for polishing semiconductor and dielectric surfaces for optical applications and must handle samples and wafers up to 100 mm in diameter while achieving RMS roughness below 1 nanometre. The tender must include technical product descriptions or data sheets proving compliance with all minimum requirements and a fully completed price sheet. The supplier must deliver, install and commission the equipment, demonstrate its performance, provide on-site instruction for at least two employees, provide at least a 12-month warranty, and ensure the required availability of spare parts and support. The maximum delivery period is 12 weeks, and the contracting authority may exclude offers with a net value above EUR 225,000.