Semi-automatic prober for characterization of 200 mm wafers

Summary

The procurement covers the supply, delivery, installation, commissioning and integration of a complete semi-automatic wafer prober for electrical and temperature-dependent characterization of 200 mm wafers at IHP in Frankfurt (Oder). The system must support DC and pulsed I-V measurements and low-frequency impedance measurements up to 10 MHz, and integrate with the existing Keithley 4200A-SCS system. The package must include six probes, a shielded chamber, wafer loading system, temperature-controlled chuck from at least -60 °C to +300 °C, microscope, CCD and lateral cameras, anti-vibration table, Windows 11 Enterprise LTSC computer, control software, displays, cables, interfaces, documentation, installation, commissioning, training and at least 10 spare Kelvin probes or probe tips. The supplier must provide a technical integration concept, on-site technician support, compliance documentation and a minimum two-year warranty. The bid must include the completed price schedule, technical offer, earliest delivery date and expected delivery and commissioning periods. Bids must be submitted electronically in text form by 13 October 2026 at 12:00. Alternative bids are not permitted. Price carries a 35% weighting and the other award criteria carry 65%.