Supply of a computer-controlled grinding, lapping and polishing system

Summary

The University of Duisburg-Essen is procuring a computer-controlled grinding, lapping and polishing system for high-precision preparation of scientific material samples, including semiconductors, oxides, ceramics, metals and other functional materials. The system is intended to produce reproducibly flat, parallel samples with a defined final thickness and high surface quality, and to support grinding, lapping, fine polishing and chemical-mechanical polishing. Delivery, on-site installation and commissioning are included.