Deep Reactive Ion Etcher (DRIE)

Summary

Uppsala University’s Myfab Uppsala is procuring one deep reactive ion etcher for transferring patterns defined by photo- and electron-beam lithography onto substrates, down to the nanometre scale. The system will be used in a university laboratory to etch silicon and other compatible materials with photoresist or hard masks. Its capabilities are intended to range from low to high etch rates and include wafer dicing, uniform etching and high-aspect-ratio structures. The contract may also include a service agreement, updates, upgrades, accessories and additional functionality.