Logic FEOL dry etch chamber

Summary

The tender concerns the supply of a dry etch chamber for the front-end-of-line (FEOL) process used in logic chip manufacturing. The contracting authority is Imec EU Pilot line NV. This is a negotiated procedure with a call for competition, and requests to participate must be submitted electronically by 2 November 2026 at 10:00. The notice does not provide technical details of the equipment; these, along with the specific participation and tender conditions, must be checked in the tender documents.