Tender detail
Tungsten shielding enclosure for an analog camera
Summary
The procurement covers the manufacture and delivery of one tungsten shielding enclosure for an analog camera. The bill of materials describes a 100 × 100 × 130 mm enclosure, main components made from a tungsten-nickel-iron alloy, and glass holders, lead glass, stainless-steel parts, EPDM seals and fasteners. Bids must be submitted electronically by 16 October 2026 at 10:00; the bid must remain binding until 16 November 2026. The contract is not divided into lots, and variant bids are not permitted. Price is the sole award criterion. Precise suitability, exclusion, security and payment conditions must be checked in the tender documents.
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